Multi-Cavity Board Level Shielding: When Maximizing PCB Real Estate and Reducing Weight is Critical | Orbel
As PCBs get smaller, the need for more RF isolation increases. Rather than having multiple shields on a PCB, which require their own solder trace, a single “multi-cavity” shield is employed.
Learn how a multi-cavity PCB shield maximizes the available board space while reducing the overall solder trace footprint by as much 25-50% in this guide from Orbel. It explains:
How multi-cavity shields are designed and produced
Design flexibility such as ventilation holes for cooling, mouse holes for trace entry/exit, and more
The two most common construction styles, FASweld™ and SmartFORM™
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